As high-end manufacturing, semiconductor inspection, biomedical technology, AR/VR, and other cutting-edge fields demand ever-higher optical system performance, the processing limits of traditional optical components are continuously broken. Micro-nano machining – with its sub-micron to nanometer-scale pattern transfer and structure fabrication capabilities – has become the core enabler for high-end, functionally integrated optical components.

The ultra-precision optics industry is now undergoing below major transformations:

-Machining accuracy shifting from the micron level to the nanometer level

-Optical components moving toward miniaturization and deep integration

The CIOE - Precision Optics Expo & Camera Expo, held from September 9–11, 2026 at the Shenzhen World Exhibition & Convention Center, is the key platform for gathering innovative forces in ultra-precision machining, resolving technical bottlenecks, and gaining insight into industry upgrade directions. >>>Get your free pass.

Ø  Precision Leap: Breaking Through from Micron‑Level to Nanometer‑Level Machining Capabilities

The core goal of ultra-precision optical machining is to achieve order‑of‑magnitude improvements in optical component surface form accuracy and surface roughness. Traditional lapping and polishing technologies have long been limited by tool wear and removal uncertainty, keeping accuracy at the micron level and failing to meet the high-end needs of frontier fields.

Recent breakthroughs in deterministic processing technologies have fundamentally changed this landscape:

-Ion beam figuring enables atomic‑level material removal, with form convergence accuracy better than λ/50 (λ=632.8nm).

-Magnetorheological finishing (MRF) achieves surface roughness below 0.5nm RMS.

-Single‑point diamond turning (SPDT) with nanometric air-bearing spindles can directly produce nanometer‑level smooth surfaces on non-ferrous metals and infrared crystals.

Meanwhile, continuous improvements in optical glass and crystal materials – their formulations and melting processes – provide a better substrate foundation for high-precision machining. However, full‑frequency error control for large-diameter aspheres and freeform surfaces, as well as subsurface damage suppression in hard and brittle materials, remain key challenges the industry must address.

Key industry players have made significant breakthroughs:

-In deterministic processing equipment: Precitech (USA) offers ultra‑precision single‑point diamond lathes achieving sub‑micron form tolerances and nanometer surface roughness.

-In optical materials: Corning launched 2.0 high‑index glass for AR/MR wearables, enabling wider fields of view, with wafer diameters covering 150mm, 200mm, and 300mm.

-Domestic advancement: ÅFiSy (Changsha Aifeisi Technology) has developed ultra‑high precision ion beam polishing equipment, with maximum part sizes from 300mm to 2m. Using non‑contact      atomic‑level removal, machining accuracy reaches the Ångstrom level (0.1nm). Surface form accuracy exceeds λ/50 PV and λ/1000 RMS(λ=632.8nm), supporting planes, spheres, aspheres, off‑axis surfaces, and freeforms – applicable to glass‑ceramics, ULE, fused silica, sapphire, single‑crystal silicon, and more. ÅFiSy has successfully broken the long‑standing foreign monopoly in ultra‑high precision ion beam polishing, providing core domestic equipment for aerospace, high‑power lasers, and semiconductor lithography.

Ø  Miniaturization & Integration: Wafer‑Level Micro-Nano Machining Drives Component Form Transformation

The urgent demand for miniaturized, arrayed, and integrated optical solutions in consumer electronics, AR/VR, optical communications, and other fields has driven the emergence of wafer‑level micro-nano machining. Using semiconductor processes such as nanoimprint lithography, grayscale lithography, and reactive ion etching, micro-nano structures such as microlens arrays, diffractive optical elements, and metasurfaces can be replicated in batches on full glass or silicon wafers – producing thousands or tens of thousands of micro‑optical components per wafer, dramatically reducing unit cost.

Furthermore, the maturation of glass wafer forming, wafer‑level coating, and dicing integration processes enables high‑precision hybrid integration of optical components with sensors and light sources. However, challenges remain: mold lifetime and uniformity in large‑area nanoimprint, temperature and stress control in wafer‑level molding, and bonding reliability for multi‑material composite wafers.

Industry breakthroughs in this area include:

-Schott AG – Full AR optical solution portfolio; its geometric reflective waveguide has achieved world‑first mass production with process yield exceeding 90%.

-GermanLitho – Launched a fully automated 310mm square‑panel nanoimprint production line. Its nanoimprint lithography system achieves better than 10nm precision and >10:1 high aspect ratio nanostructure replication, particularly suitable for mass production of AR light guide diffraction gratings, microlens arrays, and other micro/nano structures.

Ø  Ultra‑Precision Machining: A Full‑Chain Convergence Hub

The CIOE - Precision Optics Expo & Camera Expo is a highly influential professional event for the optical industry chain. It brings together the full chain of ultra‑precision optics and micro-nano machining – covering ultra‑precision processing equipment, nanoimprint equipment, optical molds, optical microlens arrays, diffractive optical elements, freeform optical components, precision optical structural parts, and more.

The exhibition focuses on the three major transformation directions of ultra‑precision optics:

-Precision Optics Processing Hall – Features ultra‑precision single‑point diamond lathes, magnetorheological finishing equipment, ion beam figuring systems, nanoimprint lithography machines, femtosecond laser processing stations, high‑precision grinding/polishing machines, and other core equipment.

-Optical Components Area – Showcases wafer‑level microlens arrays, freeform prisms, metasurfaces, binary optical elements, and other innovative products.

-Core Components & Supporting Processes – Covers high‑stiffness ultra‑precision air spindles, linear motors, nanometric grating scales, high‑speed high‑precision servo control systems, and more. AI‑powered optical inspection solutions using deep learning algorithms for automatic defect detection and real‑time machining path compensation are driving ultra‑precision machining toward intelligence.

Partial exhibitor list (in alphabetical order):
A-STAR PHOTONICS, Best Optoelectronic, Castech, CDGM Glass, Costar Group, CPG Optics, DKSH, Feilihua Quartz Glass, Gabrielle-Optech, Gaote Photonics, GOUS OPTICS, Guangyan Tech, Guoguang Optical Glass, Hengtai Optical, Hitronics Technologies, HOYA, L-Chaser Optics, Langxin Optics, New HuaGuang, Nikon, NORTH ELECTRO-OPTICS GROUP, NovelBeam, OHARA, Perfect Optics, QUARTECS, Ruisen Optic, Schneider Electric, SCHOTT AG, SCITLION, Shanneng Precision, Shibaura Machine, Taiyang Technology, UM Optics, Wavelength, Xibin Opto-electronics, Xinghai Optoelectronics, Yuchuan Optics, and many more.

Ø  Concurrent Forums: Breakthroughs & Collaboration in Micro-Nano Optics & Precision Machining

CIOE will host the 2026 Global Precision Optics Intelligent Manufacturing Forum, integrating the optical industry chain and exploring new optical technologies and applications.

-Ultra‑Precision Micro/Nano Optical Manufacturing Technology Forum – Focuses on freeform surfaces and metasurfaces, covering metalens design and manufacturing, large‑aperture and dynamically tunable technologies, nanoscale processing equipment with intelligent compensation algorithms, and cross‑scale inspection solutions – addressing mass production bottlenecks.

-Nanoimprint Manufacturing Technology Forum – Highlights nanoimprint’s high resolution, low cost, and 3D‑shaping advantages. Covers mold technology, new imprint materials and processes, large‑area defect control, and expanding applications in memory chips, AR/VR waveguides, and advanced packaging.

-2026 Precision Optical Molding Aspheric Surface Processing Technology Forum – Focuses on the high‑efficiency mass production advantages of injection molding and molded aspheric technologies, featuring technology and product launches from industry players.

>>> Click to view the conference list

Ø  Three Exhibitions Under One Roof – Empowering Full‑Chain Convergence

Ultra‑precision optics and micro-nano machining are at a critical juncture of technological breakthrough and industrial collaboration. Every step forward relies on deep coordination across the industry chain.

The CIOE - Precision Optics Expo & Camera Expo brings together the entire optical industry chain across optical components and materials, lenses and modules, coatings, machine vision, AR/VR, optical measurement, and more – creating a complete optical ecosystem to help companies achieve resource matching and complementary advantages.

This year, the exhibition will be held concurrently and co‑located with the IICIE - International Integrated Circuit Innovation Expo and elexcon - Shenzhen Electronics & Embedded Expo. With one badge, visitors can efficiently access all three exhibitions – understanding the latest technologies and trends from core components to optical processing equipment to semiconductor equipment – deeply enabling cross‑industry integration across optoelectronics, semiconductors, and electronics, and accelerating large‑scale industrial development.

The CIOE - Precision Optics Expo & Camera Expo is not only a leading window for observing technology evolution in ultra‑precision optics and micro-nano machining, but also a key hub connecting upstream and downstream industry players, enabling technology transfer, and achieving full‑chain collaboration.

Join us from September 9–11, 2026 at Shenzhen World Exhibition & Convention Center for the new era of high‑precision optical manufacturing. >>>Get your free pass to access all three events now!

About CIOE - China International Optoelectronic Exposition
The 27th China International Optoelectronic Exposition (CIOE 2026) will be held September 9–11, 2026 at the Shenzhen World Exhibition & Convention Center. As a comprehensive exhibition covering the entire optoelectronics industry chain, CIOE brings together over 4,000 high‑quality exhibitors from more than 30 countries and regions. It spans information communication, precision optics, camera technology and applications, lasers and intelligent manufacturing, infrared, ultraviolet, smart sensing, new displays, AR & VR, and optoelectronics innovation – from components to applications. CIOE serves as a one‑stop, highly efficient sourcing platform for materials, components, equipment, and solutions needed for R&D and manufacturing.

About CIOE - Precision Optics Expo & Camera Expo
The CIOE - Precision Optics Expo & Camera Expo is a highly influential professional event for the optical industry in the Asia‑Pacific region. It brings together high‑quality enterprises across the entire optical chain including optical components and materials, lenses and modules, coatings, machine vision, AR/VR, and optical measurement, creating an optical ecosystem. It helps downstream application industries such as consumer electronics, advanced manufacturing, security, and medical to discover new applications and requirements, enabling business matching, commercial collaboration, and insight into emerging trends.